LM SPE 5.08/03/135 3.5SN OR BX
LM SPE 5.08/03/135 3.5SN OR BX
LM SPE 5.08/03/135 3.5SN OR BX
Graph
Derating curve valid for 5.00 & 5.08 pitch

LM SPE 5.08/03/135 3.5SN OR BX

Printed circuit board terminals, block assembly, closed side, THT solder connection, 5.08 mm, Number of poles: 3, Solder pin length (l): 3.5 mm, tinned, orange, Box

Ürün No. 3089380000
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Approvals General ordering data Dimensions and weights Environmental Product Compliance System specifications Electrical properties Material data Packing Classifications

Approvals

ROHS
Conform  

General ordering data

Version
Printed circuit board terminals, block assembly, closed side, THT solder connection, 5.08 mm, Number of poles: 3, Solder pin length (l): 3.5 mm, tinned, orange, Box  
Order No.
3089380000  
Type
LM SPE 5.08/03/135 3.5SN OR BX  
GTIN (EAN)
4099987106535  
Qty.
500  adet
Packaging
Box  

Dimensions and weights

Depth
13,9  mm
Depth (inches)
0,547  inch
Height
19  mm
Height (inches)
0,748  inch
Height of lowest version
15,5  mm
Width
15,79  mm
Width (inches)
0,622  inch
Net weight
3,84  g

Environmental Product Compliance

RoHS Compliance Status
Compliant without exemption  
REACH SVHC
No SVHC above 0.1 wt%  

System specifications

Category
T1-B  
Mounting onto the PCB
THT solder connection  
Number of poles
3  
Number of solder pins per pole
1  
Performance-Category
T1-B 10 / 100 Mbps  
Pitch in inches (P)
0,2  "
Pitch in mm (P)
5,08  mm
Protection degree
IP20  
Side termination, characteristic
closed side  
Solder eyelet hole diameter (D)
1,3  mm
Solder eyelet hole diameter tolerance (D)
+ 0,1 mm  
Solder pin dimensions
0.95 x 0.8 mm  
Solder pin length (l)
3,5  mm
Soldering process
Manual soldering  
Wave soldering  
Transmission rate
10 / 100 Mbps  

Electrical properties

Volume resistance
1.20 mΩ  

Material data

Insulating material
Wemid (PA)  
Colour
orange  
Colour chart (similar)
RAL 2000  
Insulating material group
I  
Comparative Tracking Index (CTI)
≥ 600  
UL 94 flammability rating
V-0  
Contact base material
Copper alloy  
Contact material
Copper alloy  
Contact surface
tinned  
Coating
1-3 μm Ni  
4-6 μm SN  
Tinning type
matt  
Layer structure of solder connection
1...3 µm Ni / 4...6 µm Sn matt  
Storage temperature, min.
-40  °C
Storage temperature, max.
70  °C
Operating temperature, min.
-50  °C
Operating temperature, max.
120  °C

Packing

Packaging
Box  
VPE length
0  mm
VPE width
0  mm
VPE height
0  mm

Classifications

ETIM 6.0
EC002643  
ETIM 7.0
EC002643  
ETIM 8.0
EC002643  
ETIM 9.0
EC002643  
ETIM 10.0
EC002643  
ECLASS 9.0
27-44-04-01  
ECLASS 9.1
27-44-04-01  
ECLASS 10.0
27-44-04-01  
ECLASS 11.0
27-46-01-01  
ECLASS 12.0
27-46-01-01  
ECLASS 13.0
27-46-01-01  
ECLASS 14.0
27-46-01-01  
ECLASS 15.0
27-46-01-01