RJ45C5 S1D 2.7N4N RL
RJ45C5 S1D 2.7N4N RL
RJ45C5 S1D 2.7N4N RL
Dimensional drawing
RJ45C5 S1D 2.7N4N RL

RJ45C5 S1D 2.7N4N RL

OMNIMATE Data - RJ45 modular jack, PCB plug-in connector, Cat. 5, SMD solder connection, 90°, bottom, none, No, Plugging cycles: 750, Number of poles: 8, PA 9T, 30...80 µ" Ni / ≥ 30 µ" Au , Tape

Ürün No. 2000890000
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Approvals General ordering data Dimensions and weights Environmental Product Compliance System specifications Electrical properties Standards Material data Packing Classifications

Approvals

Approvals
![](https://assets.dam.weidmueller.com/assets/api/33feeb02-46e9-4a14-9d79-8ec5ee409fe3/DAP_Master_ICON,w_80,q_80) 
ROHS
Conform 
UL File Number Search
[UL Website](https://database.ul.com/cgi-bin/XYV/cgifind/LISEXT/1FRAME/gfilenbr.html) 
Certificate No. (cURus)
E471884 

General ordering data

Version
OMNIMATE Data - RJ45 modular jack, PCB plug-in connector, Cat. 5, SMD solder connection, 90°, bottom, none, No, Plugging cycles: 750, Number of poles: 8, PA 9T, 30...80 µ" Ni / ≥ 30 µ" Au , Tape 
Order No.
2000890000 
Type
RJ45C5 S1D 2.7N4N RL 
GTIN (EAN)
4050118382440 
Qty.
240 adet
Packaging
Tape 

Dimensions and weights

Depth
18,7 mm
Depth (inches)
0,736 inch
Height
14,85 mm
Height (inches)
0,585 inch
Height of lowest version
11,8 mm
Width
15,7 mm
Width (inches)
0,618 inch
Net weight
7,073 g

Environmental Product Compliance

RoHS Compliance Status
Compliant without exemption 
REACH SVHC
No SVHC above 0.1 wt% 

System specifications

Category
Cat. 5 
Categoría de rendimiento
Cat. 5 
Latch option
bottom 
LED
No 
Mounting onto the PCB
SMD solder connection 
Number of poles
8 
Number of solder pins per pole
1 
Pitch in inches (P)
0,05 "
Pitch in mm (P)
1,27 mm
Plugging cycles
750 
Processo di saldatura
Reflow soldering 
Manual soldering 
Product family
OMNIMATE Data - RJ45 modular jack 
Protection degree
IP20 
Shield surface
nickel-plated 
Shield tabs
none 
Shielding
Yes 
Shielding material
Brass 
Side termination, characteristic
Solder flange 
Solder eyelet hole diameter tolerance (D)
± 0.1 mm 
Solder pin length (l)
3,2 mm
Type of connection
SMD solder connection 
Výstupní tvarovka
90° 
Wiring
8-core 
Współpłaszczyznowość:
100 µm
Допуск на расположение выводов под пайку
± 0.1 mm 
솔더핀 크기
Octagonal 

Electrical properties

Dielectric strength, contact / contact
1000 V DC 
Insulation resistance
≥ 500 MΩ 
Nominal voltage
125 V
PoE / PoE+
conforming to IEEE 802.3at 
Rated current
1.5 A 
Spänningstålighet kontakt/skärm
1500 V DC 
Volume resistance
<25 mΩ 

Standards

Connector standard
IEC 60603-7-51 

Material data

Insulating material
PA 9T 
Colour
black 
Colour chart (similar)
RAL 9011 
Insulating material group
II 
Comparative Tracking Index (CTI)
≥ 500 
Insulation resistance
≥ 500 MΩ 
Moisture Level (MSL)
1 
UL 94 flammability rating
V-0 
Contact base material
Phosphorus bronze 
Contact material
Cu-alloy 
Povrch kontaktu
Gold over nickel 
Schichtaufbau - Steckkontakt
30...80 µ" Ni / ≥ 30 µ" Au 
Storage temperature, min.
-40 °C
Storage temperature, max.
85 °C
Température de fonctionnement , min.
-40 °C
Üzemi hőmérséklet, max.
85 °C

Packing

Packaging
Tape 
VPE length
354 mm
VPE width
348 mm
VPE height
130 mm
Tape reel diameter ∅ (A)
330 mm 
Surface resistance
Rs = 109 - 1012 Ω 

Classifications

ETIM 8.0
EC002637 
ETIM 9.0
EC002637 
ETIM 10.0
EC002637 
ECLASS 14.0
27-46-02-01 
ECLASS 15.0
27-46-02-01