FFP – Buchsenstecker, IDC-Anschluss

OMNIMATE® - Board-to-Board connectors
Flexible engineering of compact devices
The use of future-proof contact systems, as well as the optimisation of manufacturing processes, are increasingly important in the development of efficient industrial devices, especially in the field of Industry 4.0. OMNIMATE® board-to-board connectors feature a 1.27 mm pitch and offer maximum flexibility due to different designs.
  • Flexible device design - Industrial suitable density combined with high flexible connection combinations (Mezzanine, Mother-to-Daughter, Extender-card, Cable-to-Board)
  • Automation-Ready - Developed for automatic assembly with high precise pin coplanarity and SMT-fixation 
  • Reliable contact - Up to 500 mating cycles due to industry suitable gold-surface (PdNi-Au) 
  • Process-Ready - High performance LCP material for reflow soldering 
  • Scalability - Different heights with high contact overlapping ensure various solutions from 12 – 80 poles.
  • Robust miniaturisation - simple and safe connection even possible under unfavorable mating conditions – e.g. inclination or offset.
FFP – Buchsenstecker, IDC-Anschluss
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